Laser-Induced Exothermic Bonding of SiCp/Al Composites with Nanostructured Al/Ni Energetic Interlayer

In this study, SiCp/Al composites were bonded using the laser-induced exothermic bonding method. The nanostructured Al/Ni energetic materials prepared by high-energy ball-milling method and served as interlayer. joint microstructure was characterized SEM, EDS, TEM, XRD. effect of Zr content on shear strength investigated. results indicated that after process Al Ni particles underwent strong plastic deformations welded to each other, forming with a lamellar structure. Compared raw powders, location peak decreased 42 K, its performance significantly improved. reactions occurred in interlayer provided required heat for process. Near interface, could not react completely due cooling substrates, mixture residual metal Ni-Al compounds. addition enhanced interfacial between composites. products transformed from NiAl eutectic organization + Ni-Al-Zr, thus decreasing pores improving quality. With an increase content, first increased then decreased. When 10 wt.%, reached maximum 22 MPa.